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INTEL I3 10105F PROCESSOR (USED ITEM)

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LKR 19,000.00

or 3 X LKR 6,333.33 with Koko
or up to 4 X LKR 4,750.00 with Payzy Payzy

6 months warranty

  • 4 Cores / 8 Threads
  • Up to 4.40 GHz. Total Storage size=512 GB. Max TDP = 65 W.
  • Discrete graphics required
  • Compatible with Intel 300 Series chipset based motherboards
  • Bios update may be required for motherboard compatibility

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19,000 LKR

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19,000 LKR

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19,570 LKR

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19,570 LKR

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20,520 LKR

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20,710 LKR

PAY IN 3 X 6,903.33 LKR

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1 Days Instant Delivery

3 Days Return Period

24H Customer support

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Description

Essentials
Product Collection10th Generation Intel® Core™ i3 Processors
Code NameProducts formerly Comet Lake
Vertical SegmentDesktop
Processor Numberi3-10105
StatusLaunched
Launch DateQ1’21
Lithography14 nm
Use ConditionsPC/Client/Tablet
CPU Specifications
# of Cores4
# of Threads8
Processor Base Frequency3.70 GHz
Max Turbo Frequency4.40 GHz
Cache6 MB Intel® Smart Cache
Bus Speed8 GT/s
Intel® Turbo Boost Technology 2.0 Frequency‡4.40 GHz
TDP65 W
Supplemental Information
Embedded Options AvailableNo
DatasheetView now
Memory Specifications
Max Memory Size (dependent on memory type)128 GB
Memory TypesDDR4-2666
Max # of Memory Channels2
Max Memory Bandwidth41.6 GB/s
ECC Memory Supported ‡No
Processor Graphics
Processor Graphics ‡Intel® UHD Graphics 630
Graphics Base Frequency350 MHz
Graphics Max Dynamic Frequency1.10 GHz
Graphics Video Max Memory64 GB
4K SupportYes, at 60Hz
Max Resolution (HDMI)‡4096 x 2160@30Hz
Max Resolution (DP)‡4096 x 2304@60Hz
Max Resolution (eDP – Integrated Flat Panel)‡4096 x 2304@60Hz
DirectX* Support12
OpenGL* Support4.5
Intel® Quick Sync VideoYes
Intel® InTru™ 3D TechnologyYes
Intel® Clear Video HD TechnologyYes
Intel® Clear Video TechnologyYes
# of Displays Supported ‡3
Device ID0x9BC8
Expansion Options
Scalability1S Only
PCI Express Revision3
PCI Express Configurations ‡Up to 1×16, 2×8, 1×8+2×4
Max # of PCI Express Lanes16
Package Specifications
Sockets SupportedFCLGA1200
Max CPU Configuration1
Thermal Solution SpecificationPCG 2015C
TJUNCTION100°C
Package Size37.5mm x 37.5mm
Advanced Technologies
Intel® Optane™ Memory Supported ‡Yes
Intel® Thermal Velocity BoostNo
Intel® Turbo Boost Max Technology 3.0 ‡No
Intel® Turbo Boost Technology ‡2
Intel vPro® Platform Eligibility ‡No
Intel® Hyper-Threading Technology ‡Yes
Intel® Virtualization Technology (VT-x) ‡Yes
Intel® Virtualization Technology for Directed I/O (VT-d) ‡Yes
Intel® VT-x with Extended Page Tables (EPT) ‡Yes
Intel® Transactional Synchronization ExtensionsNo
Intel® 64 ‡Yes
Instruction Set64-bit
Instruction Set ExtensionsIntel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Idle StatesYes
Enhanced Intel SpeedStep® TechnologyYes
Thermal Monitoring TechnologiesYes
Intel® Identity Protection Technology ‡Yes
Intel® Stable Image Platform Program (SIPP)No
Security & Reliability
Intel® AES New InstructionsYes
Secure KeyYes
Intel® Software Guard Extensions (Intel® SGX)Yes with Intel® ME
Intel® OS GuardYes
Intel® Trusted Execution Technology ‡No
Execute Disable Bit ‡Yes
Intel® Boot GuardYes

Additional information

CHIPSET

INTEL B365

MANUFACTURER

INTEL

RAM TYPE

DDR4

SOCKET TYPE

INTEL – LGA1200 (10/11 GEN)

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